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AB&M.INC UV Flood exposure system |
BiON – 1431 |
Lithography |
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ADT 7910 uno Dicing Saw |
INRF – |
Packaging |
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Anatech LTD Model SP100 Plasma system |
BiON – 1402 |
Plasma-Asher |
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Anneal Tube (4″) |
INRF – W2345 |
Diffusion Furnaces |
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Anicon LTO CVD |
INRF – W2326 |
CVD System |
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Anodic Bonding Furnace up to 4 Inch |
INRF – W2326 |
Diffusion Furnaces |
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ASM LPCVD |
INRF – W2326 |
CVD System |
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Atomic Layer Deposition (ALD) |
INRF – W2339 |
Deposition |
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Boron Tube (4″) |
INRF – W2345 |
Diffusion Furnaces |
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|
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BMR Low Temp PECVD |
INRF – W2333/W2335 |
CVD System |
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Canon i4 4000 Stepper |
INRF – W2344 |
Lithography |
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CHA Mark 50 Evaporation |
INRF – W2351 |
Deposition |
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CHA Thermal evaporation (SEC-600-RAP) (Manual tool) |
INRF – W2333/W2335 |
Deposition |
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Cincinnati Sub-Zero Environmental Chamber |
INRF – W2320 |
Packaging |
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Class II Biohazard Safety Hoods |
BiON – 1421 |
Back-End Processing |
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CO2 Water Jacketed Incubator Series II |
BiON – 1421 |
Back-End Processing |
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Dektak 3 Profilometer |
INRF – W2315A,
BiON – 1402 |
Characterization |
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Dektak XT Profilometer |
INRF – W2315A |
Characterization |
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Digital Combo Embosser |
BiON – 1431 |
Hot Embossing |
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Dry and Wet Oxidation Tube (6″) |
INRF – W2345 |
Diffusion Furnaces |
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Dry Oxidation Tube (4″) |
INRF – W2345 |
Diffusion Furnaces |
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|
E-Beam evaporation (Temescal SR-10) (Manual tool) |
BiON – 1222 |
Deposition |
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 |
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E-Beam 1 evaporation (Temescal CV-8) (Manual tool) |
INRF – W2339 |
Deposition |
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|
E-Beam 2 evaporation (Temescal CV-14) (Manual tool) |
INRF |
Deposition |
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|
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FEI SEM / E-Beam Writer |
INRF – W2321 |
Lithography |
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Filmetrics F40 Nanospec |
INRF – W2315A |
Characterization |
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First Nano Furnace (EasyTube 3000 System) |
INRF – W2351 |
CVD System |
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Gaertner Ellipsometer |
INRF – W2326 |
Characterization |
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Gasonics Downstream Plasma Ashing |
INRF – W2338 |
Plasma-Asher |
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|
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Harrick Plasma Cleaner |
BiON – 1431 |
Plasma-Asher |
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|
|
Heatpulse 610 RTA |
INRF – W2345 |
Diffusion Furnaces |
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HMDS Oven |
INRF – W2338 |
Lithography |
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|
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HS200 Confocal Microscope / Profiler |
INRF – W2321 |
Characterization |
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Ion Milling (Manual tool) |
INRF – W2333/W2335 |
Dry Etching |
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|
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Inert Environment Blue M Oven 600 Degree |
INRF |
Packaging, Diffusion Furnaces |
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|
|
Karl Suss MA56 Mask Aligner |
BiON – 1402 |
Lithography |
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Karl Suss MA6 Mask Aligner |
INRF |
Lithography |
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|
Karl Suss MJB-3 Mask Aligner |
INRF |
Lithography |
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Kasper Mask Aligner model 3001 |
INRF – W2344 |
Lithography |
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|
|
K&S Aluminum Wedge Bonder |
INRF – W2318A |
Packaging |
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|
|
K&S 780 Dicing Saw |
INRF – W2315A |
Packaging |
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|
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K&S Gold Ball Bonder |
INRF – W2318A |
Packaging |
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|
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Laser Ablation Resonetics X250 |
BiON – 1401 |
Dry Etching |
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 |
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Laurell Photoresist Spinner |
INRF, BiON |
Lithography |
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|
|
Mini-Brute Tube (4″) |
INRF – W2326 |
Diffusion Furnaces |
 |
 |
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MVD 100 (Applied MST) |
BiON – 1411 |
Deposition |
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|
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Nano Furnace Tube (2″) |
INRF – W2345 |
Diffusion Furnaces |
|
|
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Nano Multi-Purpose Furnace (5″) |
INRF – W2345 |
Diffusion Furnaces |
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|
|
Nano Imprinter Jenoptik Hex03 |
BiON – 1412 |
Hot Embossing |
 |
|
|
Oriel UV Flood exposure system |
INRF – 2332 |
Lithography |
|
|
|
PE-100 Plasma Etch Benchtop System |
BiON – 1431 |
Lithography |
 |
|
 |
PE 4400 Sputtering (Manual tool) |
INRF – W2339 |
Deposition |
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|
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PE 2400 Sputtering (Manual tool) |
INRF – W2339 |
Deposition |
 |
|
|
PE 2400 Multi-Purpose Sputtering (Manual tool) |
INRF – W2333/W2335 |
Deposition |
 |
|
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Plasma-Therm PECVD Model 790 |
INRF – W2333/W2335 |
CVD System |
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|
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Plasma-Therm RIE Model 790 |
INRF – W2333/W2335 |
Dry Etching |
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|
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Quintel Mask Aligner |
INRF, BiON |
Lithography |
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|
|
REY Embosser |
BiON – 1431 |
Hot Embossing |
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|
|
Scientific Technology Embosser |
BiON – 1431 |
Hot Embossing |
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|
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SCS PDS 2010 Specialty Parylene Coating System |
BiON – 1422 |
CVD System |
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|
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SEM Hitachi S4700 / EDAX |
INRF – W2321 |
Characterization |
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|
|
Sintering Tube (4″) |
INRF – W2345 |
Diffusion Furnaces |
 |
|
|
Solitec Spinner Model 5110-CT |
INRF – W2344 |
Lithography |
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|
|
Solitec Spinner Model 5110-ND |
INRF – W2344 |
Lithography |
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|
|
Solitec Spininer Model 5110-C-TD |
INRF – W2344 |
Lithography |
 |
 |
 |
STS System DRIE |
INRF – W2333/W2335 |
Dry Etching |
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|
|
SPTS APS PM |
BiON – 1411 |
Dry Etching |
 |
|
 |
Technics II 500 |
INRF – W2338 |
Plasma-Asher |
 |
|
|
Tencor FLX-2320A Stress measurement tool |
INRF – W2315 |
Characterization |
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|
|
Tenney Environmental chamber |
INRF – W2320 |
Packaging |
 |
|
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Tousimis 815B Series C |
INRF – W2351 |
Characterization |
 |
 |
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Trion ICP/RIE |
INRF – W2339 |
Dry Etching |
|
|
|
Tylan PVD-1000 |
BiON – 1411 |
CVD System |
 |
 |
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XeF2 Pulsing Etcher |
INRF – W2329 |
Dry Etching |
 |
|
|
Xyztec Sigma Condor Bond Tester |
INRF – |
Packaging |
 |
|
|
Zeiss Xradia 410 Nano CT |
INRF – |
Characterization |