![AB&M INC UV Flood Exposure System AB&M INC UV Flood Exposure System](/wordpress/wp-content/uploads/icon-picture.gif) |
![AB&M INC UV Flood Exposure System ABM UV Flood exposure system](/wordpress/wp-content/uploads/icon-film-bw.gif) |
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AB&M.INC UV Flood exposure system |
BiON – 1431 |
Lithography |
![ADT 7910 uno Dicing Saw ADT 7910 uno Dicing Saw](/wordpress/wp-content/uploads/icon-picture.gif) |
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ADT 7910 uno Dicing Saw |
INRF – |
Packaging |
![Anatech LTD Model SP100 Plasma system Anatech LTD Model SP100 Plasma system](/wordpress/wp-content/uploads/icon-picture.gif) |
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Anatech LTD Model SP100 Plasma system |
BiON – 1402 |
Plasma-Asher |
![4 Inch Long Anneal Tube 4 Inch Long Anneal Tube](/wordpress/wp-content/uploads/icon-picture.gif) |
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Anneal Tube (4″) |
INRF – W2345 |
Diffusion Furnaces |
![Anicon LTO CVD Anicon LTO CVD](/wordpress/wp-content/uploads/icon-picture.gif) |
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![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
Anicon LTO CVD |
INRF – W2326 |
CVD System |
![Anodic Bonding Furnace up to 4 Inch Anodic Bonding Furnace up to 4 Inch](/wordpress/wp-content/uploads/icon-picture.gif) |
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Anodic Bonding Furnace up to 4 Inch |
INRF – W2326 |
Diffusion Furnaces |
![ASM LPCVD Low-Stress Nitride, Poly ASM LPCVD Low-Stress Nitride, Poly](/wordpress/wp-content/uploads/icon-picture.gif) |
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ASM LPCVD |
INRF – W2326 |
CVD System |
![Atomic Layer Deposition (ALD) Atomic Layer Deposition (ALD)](/wordpress/wp-content/uploads/icon-picture.gif) |
![Atomic Layer Deposition (ALD) Atomic Layer Deposition (ALD)](/wordpress/wp-content/uploads/icon-film-bw.gif) |
![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
Atomic Layer Deposition (ALD) |
INRF – W2339 |
Deposition |
![4 Inch Boron Tube 4 Inch Boron Tube](/wordpress/wp-content/uploads/icon-picture.gif) |
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Boron Tube (4″) |
INRF – W2345 |
Diffusion Furnaces |
![BMR Low Temp PECVD BMR Low Temp PECVD](/wordpress/wp-content/uploads/icon-picture.gif) |
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![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
BMR Low Temp PECVD |
INRF – W2333/W2335 |
CVD System |
![Canon i4 4000 Stepper Canon i4 4000 Stepper](/wordpress/wp-content/uploads/icon-picture.gif) |
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Canon i4 4000 Stepper |
INRF – W2344 |
Lithography |
![CHA Mark 50 Evaporation CHA Mark 50 Evaporation](/wordpress/wp-content/uploads/icon-picture.gif) |
![CHA Mark 50 Evaporation CHA Mark 50 Evaporation](/wordpress/wp-content/uploads/icon-film-bw.gif) |
![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
CHA Mark 50 Evaporation |
INRF – W2351 |
Deposition |
![CHA Thermal evaporation (SEC-600-RAP) CHA Thermal evaporation (SEC-600-RAP)](/wordpress/wp-content/uploads/icon-picture.gif) |
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![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
CHA Thermal evaporation (SEC-600-RAP) (Manual tool) |
INRF – W2333/W2335 |
Deposition |
![Cincinnati Sub-Zero Environmental Chamber Cincinnati Sub-Zero Environmental Chamber](/wordpress/wp-content/uploads/icon-picture.gif) |
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Cincinnati Sub-Zero Environmental Chamber |
INRF – W2320 |
Packaging |
![Class II Biohazard Safety Hoods Class II Biohazard Safety Hoods](/wordpress/wp-content/uploads/icon-picture.gif) |
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Class II Biohazard Safety Hoods |
BiON – 1421 |
Back-End Processing |
![CO2 Water Jacketed Incubator Series II CO2 Water Jacketed Incubator Series II](/wordpress/wp-content/uploads/icon-picture.gif) |
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CO2 Water Jacketed Incubator Series II |
BiON – 1421 |
Back-End Processing |
![Dektak 3 Profilometer Dektak 3 Profilometer](/wordpress/wp-content/uploads/icon-picture.gif) |
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Dektak 3 Profilometer |
INRF – W2315A,
BiON – 1402 |
Characterization |
![Dektak XT Profilometer Dektak XT Profilometer](/wordpress/wp-content/uploads/icon-picture.gif) |
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Dektak XT Profilometer |
INRF – W2315A |
Characterization |
![Digital Combo Embosser Digital Combo Embosser](/wordpress/wp-content/uploads/icon-picture.gif) |
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Digital Combo Embosser |
BiON – 1431 |
Hot Embossing |
![6 Inch Dry and Wet Oxidation Tube 6 Inch Dry and Wet Oxidation Tube](/wordpress/wp-content/uploads/icon-picture.gif) |
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Dry and Wet Oxidation Tube (6″) |
INRF – W2345 |
Diffusion Furnaces |
![4 Inch Dry Oxidation Tube 4 Inch Dry Oxidation Tube](/wordpress/wp-content/uploads/icon-picture.gif) |
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Dry Oxidation Tube (4″) |
INRF – W2345 |
Diffusion Furnaces |
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E-Beam evaporation (Temescal SR-10) (Manual tool) |
BiON – 1222 |
Deposition |
![E-Beam 1 evaporation (Temescal CV-8) E-Beam 1 evaporation (Temescal CV-8)](/wordpress/wp-content/uploads/icon-picture.gif) |
![E-Beam 1 evaporation (Temescal CV-8) E-Beam 1 evaporation (Temescal CV-8)](/wordpress/wp-content/uploads/icon-film-bw.gif) |
![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
E-Beam 1 evaporation (Temescal CV-8) (Manual tool) |
INRF – W2339 |
Deposition |
![E-Beam 2 evaporation (Temescal CV-14) E-Beam 2 evaporation (Temescal CV-14)](/wordpress/wp-content/uploads/icon-picture.gif) |
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E-Beam 2 evaporation (Temescal CV-14) (Manual tool) |
INRF |
Deposition |
![FEI SEM / E-Beam Writer FEI SEM / E-Beam Writer](/wordpress/wp-content/uploads/icon-picture.gif) |
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FEI SEM / E-Beam Writer |
INRF – W2321 |
Lithography |
![Filmetrics F40 Filmetrics F40](/wordpress/wp-content/uploads/icon-picture.gif) |
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Filmetrics F40 Nanospec |
INRF – W2315A |
Characterization |
![First Nano Furnace (EasyTube 3000 System) First Nano Furnace (EasyTube 3000 System)](/wordpress/wp-content/uploads/icon-picture.gif) |
![CHA Mark 50 Evaporation CHA Mark 50 Evaporation](/wordpress/wp-content/uploads/icon-film-bw.gif) |
![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
First Nano Furnace (EasyTube 3000 System) |
INRF – W2351 |
CVD System |
![Gaertners Ellipsometer Gaertners Ellipsometer](/wordpress/wp-content/uploads/icon-picture.gif) |
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Gaertner Ellipsometer |
INRF – W2326 |
Characterization |
![Gasonics Downstream Plasma Ashing Gasonics Downstream Plasma Ashing](/wordpress/wp-content/uploads/icon-picture.gif) |
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Gasonics Downstream Plasma Ashing |
INRF – W2338 |
Plasma-Asher |
![Harrick Plasma Cleaner Harrick Plasma Cleaner](/wordpress/wp-content/uploads/icon-picture.gif) |
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Harrick Plasma Cleaner |
BiON – 1431 |
Plasma-Asher |
![Heatpulse 610 RTA Heatpulse 610 RTA](/wordpress/wp-content/uploads/icon-picture.gif) |
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Heatpulse 610 RTA |
INRF – W2345 |
Diffusion Furnaces |
![HMDS Oven HMDS Oven](/wordpress/wp-content/uploads/icon-picture.gif) |
![HMDS Oven HMDS Oven](/wordpress/wp-content/uploads/icon-film-bw.gif) |
![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
HMDS Oven |
INRF – W2338 |
Lithography |
![HS200 Confocal Microscope HS200 Confocal Microscope](/wordpress/wp-content/uploads/icon-picture.gif) |
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HS200 Confocal Microscope / Profiler |
INRF – W2321 |
Characterization |
![Ion Milling Ion Milling](/wordpress/wp-content/uploads/icon-picture.gif) |
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Ion Milling (Manual tool) |
INRF – W2333/W2335 |
Dry Etching |
![Inert Environment Blue M Oven 600 Degree Inert Environment Blue M Oven 600 Degree](/wordpress/wp-content/uploads/icon-picture.gif) |
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Inert Environment Blue M Oven 600 Degree |
INRF |
Packaging, Diffusion Furnaces |
![Karl Suss MA56 Mask Aligner Karl Suss MA56 Mask Aligner](/wordpress/wp-content/uploads/icon-picture.gif) |
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Karl Suss MA56 Mask Aligner |
BiON – 1402 |
Lithography |
![Karl Suss MA6 Mask Aligner Karl Suss MA6 Mask Aligner](/wordpress/wp-content/uploads/icon-picture.gif) |
![Karl Suss MJB-3 Mask Aligner](/wordpress/wp-content/uploads/icon-film-bw.gif) |
![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
Karl Suss MA6 Mask Aligner |
INRF |
Lithography |
![Karl Suss MJB-3 Mask Aligner Karl Suss MJB-3 Mask Aligner](/wordpress/wp-content/uploads/icon-picture.gif) |
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Karl Suss MJB-3 Mask Aligner |
INRF |
Lithography |
![Kasper Mask Aligner model 3001 Kasper Mask Aligner model 3001](/wordpress/wp-content/uploads/icon-picture.gif) |
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Kasper Mask Aligner model 3001 |
INRF – W2344 |
Lithography |
![K&S Aluminum Wedge Bonder K&S Aluminum Wedge Bonder](/wordpress/wp-content/uploads/icon-picture.gif) |
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K&S Aluminum Wedge Bonder |
INRF – W2318A |
Packaging |
![K&S 780 Dicing Saw K&S 780 Dicing Saw](/wordpress/wp-content/uploads/icon-picture.gif) |
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K&S 780 Dicing Saw |
INRF – W2315A |
Packaging |
![K&S Gold Ball Bonder K&S Gold Ball Bonder](/wordpress/wp-content/uploads/icon-picture.gif) |
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K&S Gold Ball Bonder |
INRF – W2318A |
Packaging |
![Resonetics Micromachining Technology Rapid X 250 Resonetics Micromachining Technology Rapid X 250](/wordpress/wp-content/uploads/icon-picture.gif) |
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Laser Ablation Resonetics X250 |
BiON – 1401 |
Dry Etching |
![Laurell Photoresist Spinner Laurell Photoresist Spinner](/wordpress/wp-content/uploads/icon-picture.gif) |
![Laurell Photoresist Spinner](/wordpress/wp-content/uploads/icon-film-bw.gif) |
![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
Laurell Photoresist Spinner |
INRF, BiON |
Lithography |
![4 Inch Min-Brute Tube 4 Inch Min-Brute Tube](/wordpress/wp-content/uploads/icon-picture.gif) |
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Mini-Brute Tube (4″) |
INRF – W2326 |
Diffusion Furnaces |
![Applied MST MVD 100 MVD 100 (Applied MST)](/wordpress/wp-content/uploads/icon-picture.gif) |
![MVD 100 (Applied MST) MVD 100 (Applied MST)](/wordpress/wp-content/uploads/icon-film-bw.gif) |
![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
MVD 100 (Applied MST) |
BiON – 1411 |
Deposition |
![2 Inch Nano furnace Tube 2 Inch Nano furnace Tube](/wordpress/wp-content/uploads/icon-picture.gif) |
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![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
Nano Furnace Tube (2″) |
INRF – W2345 |
Diffusion Furnaces |
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![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
Nano Multi-Purpose Furnace (5″) |
INRF – W2345 |
Diffusion Furnaces |
![Nano Imprinter Jenoptik Hex03 Nano Imprinter Jenoptik Hex03](/wordpress/wp-content/uploads/icon-picture.gif) |
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Nano Imprinter Jenoptik Hex03 |
BiON – 1412 |
Hot Embossing |
![UV Flood exposure system UV Flood exposure system](/wordpress/wp-content/uploads/icon-picture.gif) |
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Oriel UV Flood exposure system |
INRF – 2332 |
Lithography |
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PE-100 Plasma Etch Benchtop System |
BiON – 1431 |
Lithography |
![PE 4400 Sputtering PE 4400 Sputtering](/wordpress/wp-content/uploads/icon-picture.gif) |
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![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
PE 4400 Sputtering (Manual tool) |
INRF – W2339 |
Deposition |
![PE 4400 Sputtering A PE 4400 Sputtering A](/wordpress/wp-content/uploads/icon-picture.gif) |
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![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
PE 2400 Sputtering (Manual tool) |
INRF – W2339 |
Deposition |
![PE 4400 Sputtering B PE 4400 Sputtering B](/wordpress/wp-content/uploads/icon-picture.gif) |
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PE 2400 Multi-Purpose Sputtering (Manual tool) |
INRF – W2333/W2335 |
Deposition |
![Plasma-Therm PECVD Model 790 Plasma-Therm PECVD Model 790](/wordpress/wp-content/uploads/icon-picture.gif) |
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![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
Plasma-Therm PECVD Model 790 |
INRF – W2333/W2335 |
CVD System |
![Plasma-Therm RIE Model 790 Plasma-Therm RIE Model 790](/wordpress/wp-content/uploads/icon-picture.gif) |
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![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
Plasma-Therm RIE Model 790 |
INRF – W2333/W2335 |
Dry Etching |
![Quintel Mask Aligner Quintel Mask Aligner](/wordpress/wp-content/uploads/icon-picture.gif) |
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![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
Quintel Mask Aligner |
INRF, BiON |
Lithography |
![REY Embosser REY Embosser](/wordpress/wp-content/uploads/icon-picture.gif) |
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REY Embosser |
BiON – 1431 |
Hot Embossing |
![Scientific Technology Embosser Scientific Technology Embosser](/wordpress/wp-content/uploads/icon-picture.gif) |
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Scientific Technology Embosser |
BiON – 1431 |
Hot Embossing |
![SCS PDS 2010 Specialty Parylene Coating System SCS PDS 2010 Specialty Parylene Coating System](/wordpress/wp-content/uploads/icon-picture.gif) |
|
![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
SCS PDS 2010 Specialty Parylene Coating System |
BiON – 1422 |
CVD System |
![SEM Hitachi S4700 / EDA SEM Hitachi S4700 / EDA](/wordpress/wp-content/uploads/icon-picture.gif) |
|
![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
SEM Hitachi S4700 / EDAX |
INRF – W2321 |
Characterization |
![Sintering Tube (4") Sintering Tube (4")](/wordpress/wp-content/uploads/icon-picture.gif) |
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Sintering Tube (4″) |
INRF – W2345 |
Diffusion Furnaces |
![Solitec Spinner Model 5110-CT Solitec Spinner Model 5110-CT](/wordpress/wp-content/uploads/icon-picture.gif) |
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Solitec Spinner Model 5110-CT |
INRF – W2344 |
Lithography |
![Solitec Spinner Model 5110-ND Solitec Spinner Model 5110-ND](/wordpress/wp-content/uploads/icon-picture.gif) |
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Solitec Spinner Model 5110-ND |
INRF – W2344 |
Lithography |
![Solitec spininer Model 5110-C-TD Solitec spininer Model 5110-C-TD](/wordpress/wp-content/uploads/icon-picture.gif) |
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Solitec Spininer Model 5110-C-TD |
INRF – W2344 |
Lithography |
![STS System DRIE STS System DRIE](/wordpress/wp-content/uploads/icon-picture.gif) |
![STS System DRIE](/wordpress/wp-content/uploads/icon-film-bw.gif) |
![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
STS System DRIE |
INRF – W2333/W2335 |
Dry Etching |
![SPTS APS PM SPTS APS PM](/wordpress/wp-content/uploads/icon-picture.gif) |
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SPTS APS PM |
BiON – 1411 |
Dry Etching |
![Technics II 500 Technics II 500](/wordpress/wp-content/uploads/icon-picture.gif) |
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![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
Technics II 500 |
INRF – W2338 |
Plasma-Asher |
![Tencor FLX-2320A Stress measurement tool Tencor FLX-2320A Stress measurement tool](/wordpress/wp-content/uploads/icon-picture.gif) |
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Tencor FLX-2320A Stress measurement tool |
INRF – W2315 |
Characterization |
![Tenney Environmental chamber Tenney Environmental chamber](/wordpress/wp-content/uploads/icon-picture.gif) |
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Tenney Environmental chamber |
INRF – W2320 |
Packaging |
![Tenney Environmental chamber Tenney Environmental chamber](/wordpress/wp-content/uploads/icon-picture.gif) |
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![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
Tousimis 815B Series C |
INRF – W2351 |
Characterization |
![Trion ICP/RIE Trion ICP/RIE](/wordpress/wp-content/uploads/icon-picture.gif) |
![Trion ICP/RIE Trion ICP/RIE SOP Video](/wordpress/wp-content/uploads/icon-film-bw.gif) |
![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
Trion ICP/RIE |
INRF – W2339 |
Dry Etching |
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Tylan PVD-1000 |
BiON – 1411 |
CVD System |
![XeF2 Pulsing Etcher XeF2 Pulsing Etcher](/wordpress/wp-content/uploads/icon-picture.gif) |
![XeF2 Pulsing Etcher SOP Video XeF2 Pulsing Etcher SOP Video](/wordpress/wp-content/uploads/icon-film-bw.gif) |
![Download Standard Operating Procedures icon-view-notebook](/wordpress/wp-content/uploads/icon-notebook-bw.gif) |
XeF2 Pulsing Etcher |
INRF – W2329 |
Dry Etching |
![Xyztec Sigma Condor Bond Tester Xyztec Sigma Condor Bond Tester](/wordpress/wp-content/uploads/icon-picture.gif) |
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Xyztec Sigma Condor Bond Tester |
INRF – |
Packaging |
![Zeiss Xradia 410 Nano CT Zeiss Xradia 410 Nano CT](/wordpress/wp-content/uploads/icon-picture.gif) |
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Zeiss Xradia 410 Nano CT |
INRF – |
Characterization |