Equipment

Users must USE the tool at least once every 6 months in order to maintain authorization and access to the tools. Users can submit a new training request to get re-trained and re-authorized to re-access the tool.

			Equipment	Location	Category
			AB&M.INC UV Flood exposure system	BiON – 1431	Lithography
			ADT 7910 uno Dicing Saw	INRF –	Packaging
			Anatech LTD Model SP100 Plasma system	BiON – 1402	Plasma-Asher
			Anneal Tube (4″)	INRF – W2345	Diffusion Furnaces
			Anicon LTO CVD	INRF – W2326	CVD System
			Anodic Bonding Furnace up to 4 Inch	INRF – W2326	Diffusion Furnaces
			ASM LPCVD	INRF – W2326	CVD System
			Atomic Layer Deposition (ALD)	INRF – W2339	Deposition
			Boron Tube (4″)	INRF – W2345	Diffusion Furnaces
			BMR Low Temp PECVD	INRF – W2333/W2335	CVD System
			Canon i4 4000 Stepper	INRF – W2344	Lithography
			CHA Mark 50 Evaporation	INRF – W2351	Deposition
			CHA Thermal evaporation (SEC-600-RAP) (Manual tool)	INRF – W2333/W2335	Deposition
			Cincinnati Sub-Zero Environmental Chamber	INRF – W2320	Packaging
			Class II Biohazard Safety Hoods	BiON – 1421	Back-End Processing
			CO2 Water Jacketed Incubator Series II	BiON – 1421	Back-End Processing
			Dektak 3 Profilometer	INRF – W2315A, BiON – 1402	Characterization
			Dektak XT Profilometer	INRF – W2315A	Characterization
			Digital Combo Embosser	BiON – 1431	Hot Embossing
			Dry and Wet Oxidation Tube (6″)	INRF – W2345	Diffusion Furnaces
			Dry Oxidation Tube (4″)	INRF – W2345	Diffusion Furnaces
			E-Beam evaporation (Temescal SR-10) (Manual tool)	BiON – 1222	Deposition
			E-Beam 1 evaporation (Temescal CV-8) (Manual tool)	INRF – W2339	Deposition
			E-Beam 2 evaporation (Temescal CV-14) (Manual tool)	INRF	Deposition
			FEI SEM / E-Beam Writer	INRF – W2321	Lithography
			Filmetrics F40 Nanospec	INRF – W2315A	Characterization
			First Nano Furnace (EasyTube 3000 System)	INRF – W2351	CVD System
			Gaertner Ellipsometer	INRF – W2326	Characterization
			Gasonics Downstream Plasma Ashing	INRF – W2338	Plasma-Asher
			Harrick Plasma Cleaner	BiON – 1431	Plasma-Asher
			Heatpulse 610 RTA	INRF – W2345	Diffusion Furnaces
			HMDS Oven	INRF – W2338	Lithography
			HS200 Confocal Microscope / Profiler	INRF – W2321	Characterization
			Ion Milling (Manual tool)	INRF – W2333/W2335	Dry Etching
			Inert Environment Blue M Oven 600 Degree	INRF	Packaging, Diffusion Furnaces
			Karl Suss MA56 Mask Aligner	BiON – 1402	Lithography
			Karl Suss MA6 Mask Aligner	INRF	Lithography
			Karl Suss MJB-3 Mask Aligner	INRF	Lithography
			Kasper Mask Aligner model 3001	INRF – W2344	Lithography
			K&S Aluminum Wedge Bonder	INRF – W2318A	Packaging
			K&S 780 Dicing Saw	INRF – W2315A	Packaging
			K&S Gold Ball Bonder	INRF – W2318A	Packaging
			Laser Ablation Resonetics X250	BiON – 1401	Dry Etching
			Laurell Photoresist Spinner	INRF, BiON	Lithography
			Mini-Brute Tube (4″)	INRF – W2326	Diffusion Furnaces
			MVD 100 (Applied MST)	BiON – 1411	Deposition
			Nano Furnace Tube (2″)	INRF – W2345	Diffusion Furnaces
			Nano Multi-Purpose Furnace (5″)	INRF – W2345	Diffusion Furnaces
			Nano Imprinter Jenoptik Hex03	BiON – 1412	Hot Embossing
			Oriel UV Flood exposure system	INRF – 2332	Lithography
			PE-100 Plasma Etch Benchtop System	BiON – 1431	Lithography
			PE 4400 Sputtering (Manual tool)	INRF – W2339	Deposition
			PE 2400 Sputtering (Manual tool)	INRF – W2339	Deposition
			PE 2400 Multi-Purpose Sputtering (Manual tool)	INRF – W2333/W2335	Deposition
			Plasma-Therm PECVD Model 790	INRF – W2333/W2335	CVD System
			Plasma-Therm RIE Model 790	INRF – W2333/W2335	Dry Etching
			Quintel Mask Aligner	INRF, BiON	Lithography
			REY Embosser	BiON – 1431	Hot Embossing
			Scientific Technology Embosser	BiON – 1431	Hot Embossing
			SCS PDS 2010 Specialty Parylene Coating System	BiON – 1422	CVD System
			SEM Hitachi S4700 / EDAX	INRF – W2321	Characterization
			Sintering Tube (4″)	INRF – W2345	Diffusion Furnaces
			Solitec Spinner Model 5110-CT	INRF – W2344	Lithography
			Solitec Spinner Model 5110-ND	INRF – W2344	Lithography
			Solitec Spininer Model 5110-C-TD	INRF – W2344	Lithography
			STS System DRIE	INRF – W2333/W2335	Dry Etching
			SPTS APS PM	BiON – 1411	Dry Etching
			Technics II 500	INRF – W2338	Plasma-Asher
			Tencor FLX-2320A Stress measurement tool	INRF – W2315	Characterization
			Tenney Environmental chamber	INRF – W2320	Packaging
			Tousimis 815B Series C	INRF – W2351	Characterization
			Trion ICP/RIE	INRF – W2339	Dry Etching
			Tylan PVD-1000	BiON – 1411	CVD System
			XeF2 Pulsing Etcher	INRF – W2329	Dry Etching
			Xyztec Sigma Condor Bond Tester	INRF –	Packaging
			Zeiss Xradia 410 Nano CT	INRF –	Characterization