Integrated Nanosystems Research Facility

Equipment

Users must USE the tool at least once every 6 months in order to maintain authorization and access to the tools. Users can submit a new training request to get re-trained and re-authorized to re-access the tool.

Equipment Location Category
AB&M INC UV Flood Exposure System ABM UV Flood exposure system   AB&M.INC UV Flood exposure system BiON – 1431 Lithography
ADT 7910 uno Dicing Saw     ADT 7910 uno Dicing Saw INRF – Packaging
Anatech LTD Model SP100 Plasma system     Anatech LTD Model SP100 Plasma system BiON – 1402 Plasma-Asher
4 Inch Long Anneal Tube     Anneal Tube (4") INRF – W2345 Diffusion Furnaces
Anicon LTO CVD   icon-view-notebook Anicon LTO CVD INRF – W2326 CVD System
Anodic Bonding Furnace up to 4 Inch     Anodic Bonding Furnace up to 4 Inch INRF – W2326 Diffusion Furnaces
ASM LPCVD Low-Stress Nitride, Poly     ASM LPCVD INRF – W2326 CVD System
Atomic Layer Deposition (ALD) Atomic Layer Deposition (ALD) icon-view-notebook Atomic Layer Deposition (ALD) INRF – W2339 Deposition
4 Inch Boron Tube     Boron Tube (4") INRF – W2345 Diffusion Furnaces
BMR Low Temp PECVD   icon-view-notebook BMR Low Temp PECVD INRF – W2333/W2335 CVD System
Canon i4 4000 Stepper     Canon i4 4000 Stepper INRF – W2344 Lithography
CHA Mark 50 Evaporation CHA Mark 50 Evaporation icon-view-notebook CHA Mark 50 Evaporation INRF – W2351 Deposition
CHA Thermal evaporation (SEC-600-RAP)   icon-view-notebook CHA Thermal evaporation (SEC-600-RAP) (Manual tool) INRF – W2333/W2335 Deposition
Cincinnati Sub-Zero Environmental Chamber     Cincinnati Sub-Zero Environmental Chamber INRF – W2320 Packaging
Class II Biohazard Safety Hoods     Class II Biohazard Safety Hoods BiON – 1421 Back-End Processing
CO2 Water Jacketed Incubator Series II     CO2 Water Jacketed Incubator Series II BiON – 1421 Back-End Processing
Dektak 3 Profilometer     Dektak 3 Profilometer INRF – W2315A,
BiON – 1402
Characterization
Dektak XT Profilometer     Dektak XT Profilometer INRF – W2315A Characterization
Digital Combo Embosser     Digital Combo Embosser BiON – 1431 Hot Embossing
6 Inch Dry and Wet Oxidation Tube     Dry and Wet Oxidation Tube (6") INRF – W2345 Diffusion Furnaces
4 Inch Dry Oxidation Tube     Dry Oxidation Tube (4") INRF – W2345 Diffusion Furnaces
      E-Beam evaporation (Temescal SR-10) (Manual tool) BiON – 1222 Deposition
E-Beam 1 evaporation (Temescal CV-8) E-Beam 1 evaporation (Temescal CV-8) icon-view-notebook E-Beam 1 evaporation (Temescal CV-8) (Manual tool) INRF – W2339 Deposition
E-Beam 2 evaporation (Temescal CV-14)     E-Beam 2 evaporation (Temescal CV-14) (Manual tool) INRF Deposition
FEI SEM / E-Beam Writer     FEI SEM / E-Beam Writer INRF – W2321 Lithography
Filmetrics F40     Filmetrics F40 Nanospec INRF – W2315A Characterization
First Nano Furnace (EasyTube 3000 System) CHA Mark 50 Evaporation icon-view-notebook First Nano Furnace (EasyTube 3000 System) INRF – W2351 CVD System
Gaertners Ellipsometer     Gaertner Ellipsometer INRF – W2326 Characterization
Gasonics Downstream Plasma Ashing     Gasonics Downstream Plasma Ashing INRF – W2338 Plasma-Asher
Harrick Plasma Cleaner     Harrick Plasma Cleaner BiON – 1431 Plasma-Asher
Heatpulse 610 RTA     Heatpulse 610 RTA INRF – W2345 Diffusion Furnaces