Integrated Nanosystems Research Facility

PE 4400 Sputtering

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  • Designed as a sputter down system.
  • It is a loadlocked system.
  • It has sputter etch capability for pre-cleaning substrates prior to sputter deposition.
  • Three 8" water cooled targets.

The system has a large, flat platen that the samples simply rest on. It can accommodate many types of substrates.