PE 4400 Sputtering
![PE 4400 Sputtering PE 4400 Sputtering](/wordpress/wp-content/uploads/pe-4400-sputtering-thumb.jpg)
View Photo Gallery
Download Standard Operating Procedures
- Designed as a sputter down system.
- It is a loadlocked system.
- It has sputter etch capability for pre-cleaning substrates prior to sputter deposition.
- Three 8" water cooled targets.
The system has a large, flat platen that the samples simply rest on. It can accommodate many types of substrates.