PE 4400 Sputtering

View Photo Gallery
Download Standard Operating Procedures

• Designed as a sputter down system.
• It is a loadlocked system.
• It has sputter etch capability for pre-cleaning substrates prior to sputter deposition.
• Three 8" water cooled targets.

The system has a large, flat platen that the samples simply rest on. It can accommodate many types of substrates.