Integrated Nanosystems Research Facility

CHA Mark 50 Evaporation

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Description
CHA Mark 50 Systems have become the industry standard for high vacuum deposition systems. Simplicity in design, ease of operation and unmatched reliability make the Mark 50 an excellent choice for a wide range of applications, from computer control to manual operation, from production runs to nano-scale R&D research. The Mark 50’s horizontal 32″ by 32″ water-cooled cylindrical chamber simplifies loading and unloading.

Specification
  • Dual Operation, Sputtering and Evaporation
  • Moving substrates
  • Exceptional Film Uniformity (Fixture Dependent)
  • Sputter Up
  • Process Stations
    • Round Cathodes, RF or DC (Up to 4 Stations)
    • Co-deposit
    • Bias, RF or DC
    • Substrate heating, 400°C, multi-element
    • Substrate heating, station
    • Electron beam
    • Thermal
    • Sputter etching
    • Ion beam pre-clean/etch
    • Plasma texturing/etch
  • Power Supply Options
    • Electron beam, 6-10-15 kW
    • Sputtering, 1-3-5-15-30 KW
    • Heater, 6-10-16 kW
    • Thermal deposition, 1-5-10 kW
  • Process Chamber
    • Insitu spectrophotometer
    • Drop well source
    • Easy access to front and rear door
    • Variable source-to-substrate distance
    • Variable port locations, observation port(s) and RGA port
    • Source isolation
    • Automatic wafer loading/unloading
    • Web roll coating
    • Web roll loading/unloading trolley
    • Process chamber dimensions: 32″ x 32
  • Deposition Fixturing
    • Adjustable angle planet, standard
    • Rotating disk, optionalRotating dome, optional
    • Flat planetary, 3 or 4, optional
    • Web roll with precision drive
    • Shutter(s), flag
  • Pumping Stack
    • Dry or oil sealed roughing
    • Regeneration options
    • Famous right angle pumping/plumbing
    • Exceptional pumping performance
    • High vacuum valve, vertical seal, 16″
    • Foreline and roughing valves, vertical seal, 3″
    • Large refrigeration vapor pumping options
    • Mechanical pump, minimum CFM
    • Molecular sieve trap
    • Cold trap LN2, 25L pump trap, optional water pump
    • LN2 level control
    • Ionization gauge control
    • Gas controls
  • Pumping Options
    • Cyro
    • Turbo
    • Diffusion
  • Ultimate Vacuum
    • System 10 -9 Torr
    • Chamber 10 -8 Torr
  • Cyro Coil
    • 50,000 L/Sec. pumping speed for water vapor and other condensable gases in the process chamber
  • Utilities
    • Water supply, 10 GPM
    • Air supply, 85-125 PSIG
  • Footprint
    • 79.5″ W x 64″D x 78.5″H (with ISO source add 21″H)