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The HIDEP system from BMR Technology opens a new horizon for plasma-enhanced chemical vapor deposition (PECVD), BMR’s new high density plasma CVD system HIDEP, can deposit high quality dielectric films at temperature below 100°C with high deposition rates based on BMR’s patented Hybrid Electromagnetic Energy Coupling technology.
Conventional PECVD process typically need operating temperatures in excess of 400°C to produce films with necessary electrical or physical properties of economically viable deposition rates. In Typical PECVD systems, as the deposition temperature decreases below 300°C, film morphology and integrity also decrease rapidly due to pinholes.