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SPTS’ APS process module is an ICP-based high density plasma source, designed to etch materials which are difficult to etch using conventional RIE or ICP sources.
The process chamber is of metallic construction and is heated to reduce the level of deposition on it, thereby increasing process stability and increasing the mean time between cleans by more than a factor of 10. Through the use of permanent magnets, the plasma is confined contributing to an increase in plasma density necessary for the successful etching of strongly bonded materials.
SiO2, SixNy, SiC, Al2O3