Integrated Nanosystems Research Facility

PE 2400 Multi-Purpose Sputtering

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The model 2400 Multi-Purpose Sputtering System deposits a wide variety of metallic materials onto substrates such as ceramics, metals, plastics, glass and semiconductors. The system is capable of depositing material in RF and DC sputtering modes. The bombarding ionized gas is argon and can be mixed with O2 gas for reactive sputtering. So when high voltage is passed into the vacuum chamber and ionizes the Argon gas within, these positively charged argon ions strike the metallic target at the top of the chamber and the “newly freed” metallic particle deposit onto the substrate resting below.