The Integrated Nanosystems Research Facility is an 8,600 square foot class 100/1,000/10,000 cleanroom equipped with all the major devices for micro and nano fabrication. As a user of the INRF you are provided with flexible clean room access, various processing equipment, materials and chemicals. In addition, the INRF provides training and skilled technical staff willing to assist researchers that need processing.
The INRF technical staff can also perform basic microfabrication operations for a predetermined fee. These Operations are performed on a scheduled basis only. Services include:
- One-mask lithography
Wafer materials less than 4 in diameter, Shipley 1827 photoresist, single mask (provided by user), Karl Suss aligner
Standard metals include gold, titanium, chrome, nickel. E-beam or thermal evaporation only.
- Plasma etch
Reactive ion etch of silicon oxide or silicon nitride only. Less than 1 micron thickness. Oxygen etch of polymer also performed.
Other services may be performed, but the details of the job must be discussed with INRF staff. The INRF does not perform design work or process development. Clients seeking those services are encouraged to contact INRF faculty groups directly to set up a research project.