Integrated Nanosystems Research Facility

Equipment

Users must USE the tool at least once every 6 months in order to maintain authorization and access to the tools. Users can submit a new training request to get re-trained and re-authorized to re-access the tool.

Equipment Location Category
AB&M INC UV Flood Exposure System ABM UV Flood exposure system   AB&M.INC UV Flood exposure system BiON – 1431 Lithography
Anatech LTD Model SP100 Plasma system     Anatech LTD Model SP100 Plasma system BiON – 1402 Plasma-Asher
4 Inch Long Anneal Tube     Anneal Tube (4") INRF – W2345 Diffusion Furnaces
Anicon LTO CVD   icon-view-notebook Anicon LTO CVD INRF – W2326 CVD System
Anodic Bonding Furnace up to 4 Inch     Anodic Bonding Furnace up to 4 Inch INRF – W2326 Diffusion Furnaces
ASM LPCVD Low-Stress Nitride, Poly     ASM LPCVD INRF – W2326 CVD System
Atomic Layer Deposition (ALD) Atomic Layer Deposition (ALD) icon-view-notebook Atomic Layer Deposition (ALD) INRF – W2339 Deposition
4 Inch Boron Tube     Boron Tube (4") INRF – W2345 Diffusion Furnaces
BMR Low Temp PECVD   icon-view-notebook BMR Low Temp PECVD INRF – W2333/W2335 CVD System
Canon i4 4000 Stepper     Canon i4 4000 Stepper INRF – W2344 Lithography
CHA Mark 50 Evaporation CHA Mark 50 Evaporation icon-view-notebook CHA Mark 50 Evaporation INRF – W2351 Deposition
CHA Thermal evaporation (SEC-600-RAP)   icon-view-notebook CHA Thermal evaporation (SEC-600-RAP) (Manual tool) INRF – W2333/W2335 Deposition
Cincinnati Sub-Zero Environmental Chamber     Cincinnati Sub-Zero Environmental Chamber INRF – W2320 Packaging
Class II Biohazard Safety Hoods     Class II Biohazard Safety Hoods BiON – 1421 Back-End Processing
CO2 Water Jacketed Incubator Series II     CO2 Water Jacketed Incubator Series II BiON – 1421 Back-End Processing
Dektak 3 Profilometer     Dektak 3 Profilometer INRF – W2315A,
BiON – 1402
Characterization
Dektak XT Profilometer     Dektak XT Profilometer INRF – W2315A Characterization
Digital Combo Embosser     Digital Combo Embosser BiON – 1431 Hot Embossing
6 Inch Dry and Wet Oxidation Tube     Dry and Wet Oxidation Tube (6") INRF – W2345 Diffusion Furnaces
4 Inch Dry Oxidation Tube     Dry Oxidation Tube (4") INRF – W2345 Diffusion Furnaces
      E-Beam evaporation (Temescal SR-10) (Manual tool) BiON – 1222 Deposition
E-Beam 1 evaporation (Temescal CV-8) E-Beam 1 evaporation (Temescal CV-8) icon-view-notebook E-Beam 1 evaporation (Temescal CV-8) (Manual tool) INRF – W2339 Deposition
E-Beam 2 evaporation (Temescal CV-14)     E-Beam 2 evaporation (Temescal CV-14) (Manual tool) INRF Deposition
FEI SEM / E-Beam Writer     FEI SEM / E-Beam Writer INRF – W2321 Lithography
Filmetrics F40     Filmetrics F40 Nanospec INRF – W2315A Characterization
First Nano Furnace (EasyTube 3000 System) CHA Mark 50 Evaporation icon-view-notebook First Nano Furnace (EasyTube 3000 System) INRF – W2351 CVD System
Gaertners Ellipsometer     Gaertner Ellipsometer INRF – W2326 Characterization
Gasonics Downstream Plasma Ashing     Gasonics Downstream Plasma Ashing INRF – W2338 Plasma-Asher
Harrick Plasma Cleaner     Harrick Plasma Cleaner BiON – 1431 Plasma-Asher
Heatpulse 610 RTA     Heatpulse 610 RTA INRF – W2345 Diffusion Furnaces
HMDS Oven HMDS Oven icon-view-notebook HMDS Oven INRF – W2338 Lithography
HS200 Confocal Microscope     HS200 Confocal Microscope / Profiler INRF – W2321 Characterization
Ion Milling     Ion Milling (Manual tool) INRF – W2333/W2335 Dry Etching
Inert Environment Blue M Oven 600 Degree     Inert Environment Blue M Oven 600 Degree INRF Packaging, Diffusion Furnaces
Karl Suss MA56 Mask Aligner     Karl Suss MA56 Mask Aligner BiON – 1402 Lithography
Karl Suss MA6 Mask Aligner Karl Suss MJB-3 Mask Aligner icon-view-notebook Karl Suss MA6 Mask Aligner INRF Lithography
Karl Suss MJB-3 Mask Aligner     Karl Suss MJB-3 Mask Aligner INRF Lithography
Kasper Mask Aligner model 3001     Kasper Mask Aligner model 3001 INRF – W2344 Lithography
K&S Aluminum Wedge Bonder     K&S Aluminum Wedge Bonder INRF – W2318A Packaging
K&S 780 Dicing Saw     K&S 780 Dicing Saw INRF – W2315A Packaging
K&S Gold Ball Bonder     K&S Gold Ball Bonder INRF – W2318A Packaging
Resonetics Micromachining Technology Rapid X 250     Laser Ablation Resonetics X250 BiON – 1401 Dry Etching
Laurell Photoresist Spinner Laurell Photoresist Spinner icon-view-notebook Laurell Photoresist Spinner INRF, BiON Lithography
4 Inch Min-Brute Tube     Mini-Brute Tube (4") INRF – W2326 Diffusion Furnaces
MVD 100 (Applied MST) MVD 100 (Applied MST) icon-view-notebook MVD 100 (Applied MST) BiON – 1411 Deposition
2 Inch Nano furnace Tube   icon-view-notebook Nano Furnace Tube (2") INRF – W2345 Diffusion Furnaces
    icon-view-notebook Nano Multi-Purpose Furnace (5") INRF – W2345 Diffusion Furnaces
Nano Imprinter Jenoptik Hex03     Nano Imprinter Jenoptik Hex03 BiON – 1412 Hot Embossing
UV Flood exposure system     Oriel UV Flood exposure system INRF – 2332 Lithography
      PE-100 Plasma Etch Benchtop System BiON – 1431 Lithography
PE 4400 Sputtering   icon-view-notebook PE 4400 Sputtering (Manual tool) INRF – W2339 Deposition
PE 4400 Sputtering A   icon-view-notebook PE 2400 Sputtering (Manual tool) INRF – W2339 Deposition
PE 4400 Sputtering B     PE 2400 Multi-Purpose Sputtering (Manual tool) INRF – W2333/W2335 Deposition
Plasma-Therm PECVD Model 790   icon-view-notebook Plasma-Therm PECVD Model 790 INRF – W2333/W2335 CVD System
Plasma-Therm RIE Model 790   icon-view-notebook Plasma-Therm RIE Model 790 INRF – W2333/W2335 Dry Etching
Quintel Mask Aligner   icon-view-notebook Quintel Mask Aligner INRF, BiON Lithography
REY Embosser     REY Embosser BiON – 1431 Hot Embossing
Scientific Technology Embosser     Scientific Technology Embosser BiON – 1431 Hot Embossing
SCS PDS 2010 Specialty Parylene Coating System   icon-view-notebook SCS PDS 2010 Specialty Parylene Coating System BiON – 1422 CVD System
SEM Hitachi S4700 / EDA   icon-view-notebook SEM Hitachi S4700 / EDAX INRF – W2321 Characterization
Sintering Tube (4")     Sintering Tube (4") INRF – W2345 Diffusion Furnaces
Solitec Spinner Model 5110-CT     Solitec Spinner Model 5110-CT INRF – W2344 Lithography
Solitec Spinner Model 5110-ND     Solitec Spinner Model 5110-ND INRF – W2344 Lithography
Solitec spininer Model 5110-C-TD     Solitec Spininer Model 5110-C-TD INRF – W2344 Lithography
STS System DRIE STS System DRIE icon-view-notebook STS System DRIE INRF – W2333/W2335 Dry Etching
SPTS APS PM     SPTS APS PM BiON – 1411 Dry Etching
Technics II 500   icon-view-notebook Technics II 500 INRF – W2338 Plasma-Asher
Tencor FLX-2320A Stress measurement tool     Tencor FLX-2320A Stress measurement tool INRF – W2315 Characterization
Tenney Environmental chamber     Tenney Environmental chamber INRF – W2320 Packaging
Tenney Environmental chamber   icon-view-notebook Tousimis 815B Series C INRF – W2351 Characterization
Trion ICP/RIE Trion ICP/RIE SOP Video icon-view-notebook Trion ICP/RIE INRF – W2339 Dry Etching
      Tylan PVD-1000 BiON – 1411 CVD System
XeF2 Pulsing Etcher XeF2 Pulsing Etcher SOP Video icon-view-notebook XeF2 Pulsing Etcher INRF – W2329 Dry Etching