Integrated Nanosystems Research Facility

K&S 780 Dicing Saw (staff tool)

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  • Manual wafer load 
  • 6" porous vacuum chuck 
  • Vacuum gauge
  • 2" spindle
  • CCD Camera
  • Magnification: up to 200x
  • Surfactant Metering Pump – .6GPH 
  • 200-240V, 50/60Hz, 3,000 Watts, 1PH
  • Operator Manual

X Cutting Axis:

  • Travel: 11.5"
  • Min Speed: .0007"/sec
  • Max Speed: 15.62"/sec
  • Resolution: .00015" (4 microns)

Y Index Axis:

  • Travel: 6.5"
  • Max Speed: 1"/sec
  • Resolution: .000032" (.8 microns)

Z Vertical Axis:

  • Travel: 1"
  • Maximum Speed: 1"/sec
  • Resolution: .000032" (.8 microns)