Integrated Nanosystems Research Facility

INRF & BiON Users,

The 3 wet etch rooms in the BiON are currently temporarily offline as staff looks further into the lab bench re-certifications. You may notice the electronic keycards not allow access into these 3 wet etch rooms as a result.

HF and Inorganic Wet Processes are available in the INRF. Please email Richard Chang at rschang@uci.edu for access.

-Staff

BiON Users,

The 3 wet etch rooms are currently temporarily offline as staff looks further into the lab bench re-certifications. You may notice the electronic keycards not allow access into these 3 wet etch rooms as a result.

-Staff

INRF & BiON Users,

Five fume hoods/ lab benches ( 4 in the BiON, 1 in the INRF) went through re-certification and failed today by EH&S and Risk Services (more were tested but those passed and so nothing to note there).  A ticket has been opened up with Facilities Management to work to address the issues with the 5 fume hoods ASAP.

Please note the signs posted on those individual fume hoods/ lab benches that are tagged out and offline.

Hazardous operations cannot be performed in these hoods until the face velocity issues are addressed and corrected.

Thanks,

-Staff

All,

 

In the coming weeks Ushio America, Inc. will be coming on-site to host a free of charge demo session of their  172nm Photo Bonding System that has been located in the BiON of Calit2.   The Ushio, Inc. bonder is a 172nm Photo Bonding System equipped with a UV lamp with an emission wavelength center at 172nm. This is a system that irradiates an object with 172nm light for a specified period of time. Objects to be irradiated can be joined and bonded on top of each other and pressurized using the bonding unit.

 

This free of charge demo session will include Ushio America, Inc. engineers bonding glass to PDMS, PDMS to PDMS, PMMA to PMMA, and COP to COP. The time and date of this session will depend on RSVPs so please RSVP if any interest to Steven Martinez at stevenm4@uci.edu so that we can begin coordinating the session.

 

For those interested in bonding additional materials beyond this list, we will also work to see if we can help demonstrate a successful bond with your samples. If interested, please review the additional links at the end of this message and send an email to Steven Martinez at stevenm4@uci.edu with a detailed description of the bond you hope to achieve with this system. Please include as many details as possible (sample dimensions, materials to be bonded, etc.) and send this email as soon as possible / well in advance of the demo session. Depending on interest levels for these additional bonds, either these additional bonds will be demonstrated/tested at the end of the demo session, or additional sessions for these specific applications will be scheduled.

 

Additional Links Below.

Presentation Slides from Summer 2017: https://www.inrf.uci.edu/wordpress/wp-content/uploads/ushio-photobonding-technology.pdf

 

INRF/BiON SOP: https://www.inrf.uci.edu/wordpress/wp-content/uploads/op-ushio-photo-bonding-system.pdf

 

Equipment YouTube Tutorial: https://www.youtube.com/watch?v=4QQW44U-sV4&feature=youtu.be

 

https://www.inrf.uci.edu/bion/

 

https://www.inrf.uci.edu/

 

Thank You,

 

Steven Martinez

stevenm4@uci.edu

BiON Users,

The BiON compressed air is OFFLINE due to some issues with the campus compressed air system.  Tools that need compressed air are Offline on the Forged but please also take note of any physical signs/tags.

-Staff

INRF & BiON Users,

The INRF’s wet processing capabilities have been restored.  Please be sure to check with staff and receive proper approvals BEFORE processing as some things may have changed and/or are different from that of the BiON.

-Staff

STS Users,

Staff won’t be able to get a chance to get to the STS PM in the next couple of days, so the STS won’t be offline for 2 days for a PM in the near term.

Please continue to alert staff if any issues arise during the use of the tool and please continue to keep the load lock under vacuum for as much as possible (minimize the time you load a wafer at atmosphere).

We’ll update again when we have a better idea when.

-Staff

SPTS , STS and Trion Users,

1- Please remember that users of the SPTS, STS, and Trion may NOT change any other recipe parameters other than TIME.   Do NOT enable/disable other equipment set-points either like He Leak Up Rate interlocks or any pre-set values.
If you wish to modify parameters other than just the TIME you MUST receive explicit permission from staff in advance.
2- Staff is also finding that <30min post-process cleaning times are insufficient.  So instead of having half the etch time as the clean time as a rule. The new rule is as follows:
Users must run the post-process run chamber plasma cleaning for half of the processed etch time or for a minimum of 30 minutes.  That is, any etch processes <60min require a 30min or longer plasma clean, and any etch processes >60min must have a clean time of half of the etch time.
Examples:
10min etch = 30min clean
20min etch = 30min clean
50min etch = 30min clean
80min etch =40min clean
90min etch =45min clean
3- For the SPTS, users MUST run their clean recipes that are “with wafer”.
*Reminder: Staff also recommends a clean prior to your process run to help ensure process repeatability
-Staff

STS Users,

The INRF’s STS load lock gate valve is in need of a PM.  The PM is expected to take 2 days, so to best accommodate users please send your scheduled reservations of the tool to Richard at rschang@uci.edu  so that we can schedule the PM to minimize user impact.

Thank You,

Staff

Please see the reminder below for this event.  Please RSVP as soon as possible if you plan to attend as the event may be postponed / cancelled if lacking interest.

Good Afternoon,

We will be hosting Kurt J. Lesker Company on February 15th from 10:00AM – 2:30PM and February 16th from 9:00AM – 1:00PM.
They will be teaching 3 classes from their Lesker University Vacuum Technology program.  The event is free to all participants and food will also be provided.  For more details including exact topics covered please see the attached .pdf program.
Schedule:
Thursday Feb 15th 10:00AM- 2:30PM – Class 1: Introduction to Vacuum Science and System Design
Friday Feb 16th 9:00AM-1:00PM – Class 2: Physical Vapor Deposition and Thin Film Growth Models and Class 4: Introduction to Vacuum System Design
Please RSVP as soon as possible to Marc Palazzo at mdpalazz@uci.edu .  Event locations are TBD.
-Staff