INRF & BiON Users,
The INRF’s wet processing capabilities have been restored. Please be sure to check with staff and receive proper approvals BEFORE processing as some things may have changed and/or are different from that of the BiON.
-Staff
Integrated Nanosystems Research Facility
STS Users,
Staff won’t be able to get a chance to get to the STS PM in the next couple of days, so the STS won’t be offline for 2 days for a PM in the near term.
Please continue to alert staff if any issues arise during the use of the tool and please continue to keep the load lock under vacuum for as much as possible (minimize the time you load a wafer at atmosphere).
We’ll update again when we have a better idea when.
-Staff
SPTS , STS and Trion Users,
1- Please remember that users of the SPTS, STS, and Trion may NOT change any other recipe parameters other than TIME. Do NOT enable/disable other equipment set-points either like He Leak Up Rate interlocks or any pre-set values.
If you wish to modify parameters other than just the TIME you MUST receive explicit permission from staff in advance.
2- Staff is also finding that <30min post-process cleaning times are insufficient. So instead of having half the etch time as the clean time as a rule. The new rule is as follows:
Users must run the post-process run chamber plasma cleaning for half of the processed etch time or for a minimum of 30 minutes. That is, any etch processes <60min require a 30min or longer plasma clean, and any etch processes >60min must have a clean time of half of the etch time.
Examples:
10min etch = 30min clean
20min etch = 30min clean
50min etch = 30min clean
80min etch =40min clean
90min etch =45min clean
3- For the SPTS, users MUST run their clean recipes that are “with wafer”.
*Reminder: Staff also recommends a clean prior to your process run to help ensure process repeatability
-Staff
STS Users,
The INRF’s STS load lock gate valve is in need of a PM. The PM is expected to take 2 days, so to best accommodate users please send your scheduled reservations of the tool to Richard at rschang@uci.edu so that we can schedule the PM to minimize user impact.
Thank You,
Staff
Reminder, Please RSVP ASAP: Workshop Opportunity: Lesker University Vacuum Technology Classes
February 9, 2018
Please see the reminder below for this event. Please RSVP as soon as possible if you plan to attend as the event may be postponed / cancelled if lacking interest.
Good Afternoon,
We will be hosting Kurt J. Lesker Company on February 15th from 10:00AM – 2:30PM and February 16th from 9:00AM – 1:00PM.
They will be teaching 3 classes from their Lesker University Vacuum Technology program. The event is free to all participants and food will also be provided. For more details including exact topics covered please see the attached .pdf program.
Schedule:
Thursday Feb 15th 10:00AM- 2:30PM – Class 1: Introduction to Vacuum Science and System Design
Friday Feb 16th 9:00AM-1:00PM – Class 2: Physical Vapor Deposition and Thin Film Growth Models and Class 4: Introduction to Vacuum System Design
Please RSVP as soon as possible to Marc Palazzo at mdpalazz@uci.edu . Event locations are TBD.
-Staff
Good Afternoon,
We will be hosting Kurt J. Lesker Company on February 15th from 10:00AM – 2:30PM and February 16th from 9:00AM – 1:00PM.
They will be teaching 3 classes from their Lesker University Vacuum Technology program. The event is free to all participants and food will also be provided. For more details including exact topics covered please see the attached .pdf program.
Schedule:
Thursday Feb 15th 10:00AM- 2:30PM – Class 1: Introduction to Vacuum Science and System Design
Friday Feb 16th 9:00AM-1:00PM – Class 2: Physical Vapor Deposition and Thin Film Growth Models and Class 4: Introduction to Vacuum System Design
Please RSVP as soon as possible to Marc Palazzo at mdpalazz@uci.edu . Event locations are TBD.
-Staff