Silicon Mold

INRF offers photolithography and STS Deep reactive-ion etching to create deep penetration, steep-sided holes and trenches in Si wafers as a master mold for making PDMS microfluidics channels. Si mold allows lower cost for mass manufacturing of PDMS microfluidics, easier cleaning and longer reusability of the Si master compared to conventional photoresist master.

Equipment used:

• Hotplate.
• Oven.
• Laurell Photoresist Spinner.
• Karl Suss MA6 Mask Aligner.
• STS System DRIE.
• Vacuum Oven.
• SEM Hitachi S4700 / EDAX to create the Silicon mold and PDMS microfludics channels.