Integrated Nanosystems Research Facility

SEM Hitachi S4700 / EDAX applications in devices’ fabrication

Si mold allows lower cost for mass manufacturing of PDMS microfluidics, easier cleaning and longer reusability of the Si master compared to conventional photoresist master.
Plating metal on non-conductive materials surface is widely used for fabricating compact electronic devices. A key difference between plating on non-conductive materials and plating on metal substrates is that the former requires a more highly specialized pretreatment to achieve the desired result.