Metal Plating

Plating metal on non-conductive materials surface is widely used for fabricating compact electronic devices. A key difference between plating on non-conductive materials and plating on metal substrates is that the former requires a more highly specialized pretreatment to achieve the desired result. UV irradiation treatment is the most efficient new technique to improve the adhesion strength between the plating layer and non-conductive materials. This image shows some result of Cu plated on PDMS, Polyimide surface with UV irradiation treatment method.

Equipment used:

• Hotplate.
• Oven.
• Laurell Photoresist Spinner.
• AB&M UV Flood Exposure.
• UV Rays surface processor KOL2-300.
• Electroless plating.
• Electroplating.
• SEM Hitachi S4700 / EDAX to create the copper plated on non-conductive materials surface.