K&S 780 Dicing Saw (staff tool)

View Photo Gallery

• Manual wafer load 
• 6" porous vacuum chuck 
• Vacuum gauge
• 2" spindle
• CCD Camera
• Magnification: up to 200x
• Surfactant Metering Pump – .6GPH 
• 200-240V, 50/60Hz, 3,000 Watts, 1PH
• Operator Manual

X Cutting Axis:

• Travel: 11.5"
• Min Speed: .0007"/sec
• Max Speed: 15.62"/sec
• Resolution: .00015" (4 microns)

Y Index Axis:

• Travel: 6.5"
• Max Speed: 1"/sec
• Resolution: .000032" (.8 microns)

Z Vertical Axis:

• Travel: 1"
• Maximum Speed: 1"/sec
• Resolution: .000032" (.8 microns)