Hesse GmbH was founded in 1986 and is based in Paderborn. The main expertise of Hesse GmbH is the development, manufacturing and marketing of fully automated machines for the assembly and connection technology together with standard or product specific automation solutions.
Hesse GmbH is one of the world’s leading producers of fully automated Wedge-Wedge Bonders, software for monitoring ultrasonic-bond-processes as well as customized tools and machines.
Many industrial companies using wire bonding and interconnection technology (semiconductor manufacturers, RF/Microwave, automotive, medical, etc.) are among the worldwide customers of Hesse GmbH.. Optimum local support for our customers, especially in the important markets such as Asia and America, is ensured by subsidiaries in Hong Kong, USA and Japan with their own Sales and Service. Furthermore, we have partner companies and co-operations in over 30 countries.
The core competencies of the company are mechatronic systems, ultrasonic technology, control engineering and in particular the detailed knowledge of the processes and physical effects relevant in ultrasonic bonding technology. In order to maintain and expand technological leadership, we conduct intensive research and development in all aforementioned areas. There are international co-operations with universities and research institutes. Development goals include simple and wear-free constructions with highly integrated functionality and the integration of intelligent systems for achieving fault-free processes such as the patented process integrated quality control (PiQC) which records and evaluates quality-relevant parameters in real time. For in-depth information on Hesse GmbH, click here to visit the company website.
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Fully Automatic Heavy Wire Wedge Bonder
Fully Automatic Heavy Wire Wedge BonderBondjets BJ955 and BJ959 of the new bonder generation are ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates, chips and other materials. The systems can be used as a fully automatic machine or operated manually. Hesse offers the only available solution on the market of handling wires from 50 µm up to 600 µm** with only one bondhead.
Bondjet BJ955/959 are characterized by several new features:
High Speed Fully Automatic Fine Wire Wedge Bonder
The Bondjet BJ820 is the world´s leading fully automated fine wire wedge wedge bonder. The BJ820 is ready for all wire bonding challenges on a single platform, using wires and ribbons made of aluminium, copper and gold. Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics.
The BJ820 defines the latest state of technological development compared to the competition and is benchmark for: