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This tool is a four-pocket e-beam evaporator used for depositing Au, Ti, Ni, Cr, Si, Ge and Pt. Other materials need to be cleared with the staff. The wafers are loaded on a stationary planetary substrate holder. The system will pump down to the base pressure of 2e-6 Torr using a cryo pump. The pumping speed is typically two hours. The metal deposition thickness is measured in real-time by an INFICON model XTC/2 crystal monitor. To verify the deposited metal thickness, use the Dektak profilometers.