Kyosei supports the manufacture of “strong products” that can compete successfully in global markets. Kyosei specializes in detailed processing of thin sheet metal using photoetching technologies and manufactures primarily core devices that support cutting-edge technologies in areas such as automobiles and smartphones.
Our company was founded in 1963 as a manufacturer of precision components, mainly electronics-related components, manufactured from various metal foil materials (of thickness 0.004–3.0 mm) using photoetching processes.
Currently, Kyosei services a broad range of needs, including electronics, optical devices, automotive, office automation equipment, mobile phone, communication equipment, and more.
For in-depth information on Kyosei, visit the company website.
At Kyosei, our +ONE solution combines precision processing using photo etching technology with a diverse range of other processes to realize unprecedented and innovative shapes and functions. Photoetching is a high-precision processing technology that employs photography principles to chemically erode metals and other materials, creating complex and detailed shapes. Photoetching is ideal for manufacturing extremely small, thin, or fine components and also products with special shapes. It offers the following benefits compared to other processing methods (laser processing, pressing, cutting, electrocasting, etc.).
Kyosei specializes in detailed processing of thin sheet metal using photoetching technologies and manufactures primarily core devices that support cutting-edge technologies in areas such as automobiles and smartphones.
Fully Automatic Heavy Wire Wedge Bonder
Fully Automatic Heavy Wire Wedge BonderBondjets BJ955 and BJ959 of the new bonder generation are ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates, chips and other materials. The systems can be used as a fully automatic machine or operated manually. Hesse offers the only available solution on the market of handling wires from 50 µm up to 600 µm** with only one bondhead.
Bondjet BJ955/959 are characterized by several new features:
High Speed Fully Automatic Fine Wire Wedge Bonder
The Bondjet BJ820 is the world´s leading fully automated fine wire wedge wedge bonder. The BJ820 is ready for all wire bonding challenges on a single platform, using wires and ribbons made of aluminium, copper and gold. Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics.
The BJ820 defines the latest state of technological development compared to the competition and is benchmark for: